MAGNETRON SPUTTERING COATING INSTRUMENT

PRODUCT DESCRIPTION

This device adopts modular design, compact structure and easy operation, specially tailored for colleges, research institutions and small R&D laboratories. The core function of the equipment is to achieve thin film deposition of various materials through magnetron sputtering technology under vacuum or controlled atmosphere conditions. The materials that can be processed include:

·Metal materials (such as copper, aluminum, titanium, gold, silver, etc.);

·Semiconductor materials (such as silicon, gallium nitride, zinc oxide, etc.);

·Insulation materials (such as silicon dioxide, aluminum oxide, silicon nitride, etc.);

·Composite materials (such as carbon nanotube composite films, metal ceramic composite films, etc.).

The equipment is suitable for preparing various functional films, such as:

·In the field of electronic information: integrated circuit electrode film, sensor sensitive film, flexible electronic device conductive film;

·In the field of optics: anti reflective film, high reflectivity film, filter film, optical anti-counterfeiting film;

·Surface engineering field: wear-resistant coatings (such as diamond-like carbon films), corrosion-resistant coatings, biocompatible coatings;

·New energy field: transparent conductive film for solar cells, electrolyte film for solid-state batteries.

PRODUCT FEATURES

1. Coating performance

·Advantages of magnetron sputtering technology: By constraining electron motion through a magnetic field, the atomic ionization rate of the target material is significantly improved, and the deposition rate is 3-5 times higher than traditional evaporation coating. It can prepare uniform and dense thin films (with controllable thickness up to the nanometer level) in a short period of time.

·Multi target collaborative work: Equipped with a dual target sputtering chamber as standard and a four target rotating target holder as optional, it supports sequential sputtering or co sputtering of multiple materials, meeting the preparation requirements of complex structures such as multi-element alloy films, gradient films, superlattice films, etc.

2. Intelligent process control

·Full process automation: equipped with PLC programmable control system, supporting custom coating process parameters (such as sputtering power, gas flow rate, deposition time, substrate speed, etc.), can preset more than 20 sets of process programs, and automatically complete the entire process of vacuum pumping, atmosphere adjustment, sputtering deposition, cooling, etc. after one click start.

·Precision temperature control system: The substrate stage is equipped with a resistance heating module (with a temperature of up to 600 ℃) and a water-cooled temperature control module, supporting gradient heating/cooling programming, which can control the temperature environment during the film growth process and optimize the quality of film crystallization.

3. Flexible atmosphere environment

·Wide range vacuum capability: using a combination of molecular pump and mechanical pump, the ultimate vacuum degree can reach 5 × 10 ?? Pa, meeting the requirements of high-purity film preparation;

·Multi atmosphere dynamic control: equipped with a three-way mass flow controller (MFC), it can real-time control the flow ratio (accuracy ± 1%) of gases such as argon (Ar), nitrogen (N ?), oxygen (O ?), methane (CH ?), etc., supporting reactive sputtering (such as preparing oxide and nitride thin films) and atmosphere annealing processes.

4. Humanized design and safety guarantee

·Visual operation interface: equipped with a color touch screen, real-time display of key parameters such as vacuum degree, gas flow rate, temperature, power, etc., supporting historical data storage and export (USB interface);

·Safety protection mechanism: equipped with vacuum interlock protection, over temperature * *, gas leakage monitoring and other functions to ensure the safety of personnel and samples during equipment operation;

·Maintenance convenience: The sputtering chamber adopts a quick detachable structure, and operations such as target material replacement and chamber cleaning can be completed within 10 minutes, greatly reducing downtime for maintenance.

5. Scalability and compatibility

·Optional upgrade module:

·In situ detection components: can be equipped with film thickness monitoring instruments (quartz crystal oscillation method) and reflective laser thickness gauges to monitor the growth thickness of thin films in real time;

·Plasma cleaning function: equipped with an RF plasma pretreatment module, the substrate surface is etched and cleaned before deposition to improve film adhesion;

·Sample rotation/tilt device: The substrate stage supports adjustable rotation speed from 0-200 rpm and tilt angle from 0-45 °, improving the uniformity of the film.

TYPICAL APPLICATION SCENARIOS

1. Research and development of nanodevices: Sputtering and depositing titanium/gold (Ti/Au) electrodes on silicon substrates for the preparation of field-effect transistors (FETs);

2. Optical thin film experiment: Preparation of silicon dioxide (SiO ?)/titanium oxide (TiO ?) multilayer anti reflective film by magnetron sputtering for solar cell glass;

3. Biomedical research: Sputtering hydroxyapatite (HA) coating on titanium alloy surface to enhance the biocompatibility of implants;

4. In the field of flexible electronics: Sputtering silver nanowire conductive film on polyimide (PI) flexible substrate for wearable device electrodes.

SUMMARY OF EQUIPMENT ADVANTAGES

·Multi purpose: compatible with multiple modes such as single target sputtering, multi target co sputtering, and reactive sputtering, meeting the needs of all stages from basic research to process development;

·Accurate and controllable: The control accuracy of key parameters (vacuum degree, temperature, gas flow rate, power) reaches the industrys * * level, and the experimental repeatability error is less than 5%;

·Low consumption * *: Adopting energy-saving sputtering power supply, energy consumption is reduced by 20% compared to traditional equipment under the same process, suitable for long-term continuous operation.