Model 350 Four-source Organic and Inorganic Thermal Evaporation Coating Apparatus

Main Applications:

Used for the preparation of new thin film materials such as nano-scale single-layer and multi-layer functional films, hard films, metal films, semiconductor films, dielectric films, etc. Widely used in thin film material research and small-batch preparation in colleges, universities, and research institutes. 

System composition:

It mainly consists of vacuum chamber system, evaporation chamber, evaporation source system, sample stage system, vacuum pumping and measurement system, gas circuit system, control system, film thickness test system, upper cover hydraulic opening mechanism, and electronic control system. 

Technical indicators:

Ultimate vacuum degree : 5×10-5Pa ;

System leakage rate: 1×10-7PaL/S;

Vacuum Recovery Time: 40 minutes to reach 6.6×10 Pa (after a brief exposure to the atmosphere and filling with dry nitrogen, vacuuming begins) . 

Vacuum Chamber: Circular, 300×350 mm . 

Sample Stage: 3-inch×3-inch, 3.2 mm thick flat sample. 

Metal Electrode: Quantity: 1, standard brazed, indirect water-cooled structure; diameter: 20 mm, internally water-cooled. Film deposition is performed by upward evaporation. 

Organic Beam Source Furnace: Quantity: 3, standard 600°C temperature control, upward evaporation. 

Sample Holder: The substrate turntable has a position for a sample holder (accommodates 2-inch sample holders) and a hole for mounting a heating furnace. To improve film thickness uniformity within the 2-inch substrate stage, the substrate rotates at the coating position. The temperature of the substrate ranges from room temperature to 600°C (the temperature of the silicon wafer surface only needs to be calibrated once) 

4 sets of baffle systems: substrate baffle and source baffle; there are 3 sets of target baffles, with manual control of dynamic seal; sample baffle (1 set), magnetic fork, manual control

Gas system: Mass flow controller 1-way quartz crystal oscillator film thickness controller: film thickness measurement range 0-999999Å Optional molecular pump group or cryogenic pump combined with vortex dry pump exhaust system .